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  1. 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility
    3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility
    Lih-Tyng Hwang
    Wiley-IEEE Press
    Ebook
    Sofort lieferbar

    An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering pa...

    114,99 € Ebook
    Alle Preise inkl. MwSt
  2. 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility
    3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility
    Lih-Tyng Hwang
    Wiley-IEEE Press
    Ebook
    Sofort lieferbar

    An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering pa...

    114,99 € Ebook
    Alle Preise inkl. MwSt
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