Electromigration Modeling at Circuit Layout Level (eBook) von Cher Ming Tan

Electromigration Modeling at Circuit Layout Level
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53,49 €* eBook

ISBN-13:
9789814451215
Veröffentl:
2013
Einband:
eBook
Seiten:
103
Autor:
Cher Ming Tan
Serie:
SpringerBriefs in Reliability SpringerBriefs in Applied Sciences and Technology
eBook Format:
PDF
eBook-Typ:
Reflowable eBook
Kopierschutz:
Digital Watermark [Social-DRM]
Sprache:
Englisch
Inhaltsverzeichnis
Introduction.- 3D Circuit Model Construction and Simulation.- Comparison of EM Performance in Circuit Structure and Test Structure.- Interconnect EM Reliability Modeling at Circuit Layout Level.- Conclusion.
Beschreibung
Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.

 

Schlagwörter zu:

Electromigration Modeling at Circuit Layout Level von Cher Ming Tan - mit der ISBN: 9789814451215

3D Modeling; Atomic Flux Divergence (AFD); Circuit Layout Level; Electro-thermo-structural Simulations; Electromigration (EM) Issues; Finite Element Analysis; Interconnect Reliability; quality control, reliability, safety and risk; C; Security Science and Technology; Atomic, Molecular and Chemical Physics; Electronic Circuits and Systems; Engineering, Online-Buchhandlung


 

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