Microwave and Millimetre-Wave Design for Wireless Communications (E-Book) von Ian Robertson

About the Authors xvii

Acknowledgements xix

Preface xxi

1 Introduction 1

1.1 A Brief Timeline of Consumer Electronics 2

1.2 The Electromagnetic Spectrum 3

1.3 Industry Trends 7

1.4 Forms of Wireless Communication 12

1.5 Conclusion 30

References 31

2 Transmitters and Receivers 32

2.1 Introduction 32

2.2 Transmitter and Receiver Components 33

2.3 Noise and Interference 38

2.4 Introduction to Modulation 48

2.5 Digital Modulation 50

2.6 Noise Analysis and Link Budget Calculation 61

2.7 Some Wireless Transceiver Architectures 71

2.8 Conclusion 79

References 80

3 Scattering Parameters 81

3.1 Introduction 81

3.2 Z-Parameters (Open-Circuit Impedance Parameters) 81

3.3Y-Parameters (Short-Circuit Admittance Parameters) 82

3.4H-Parameters (Hybrid Parameters) 83

3.5ABCD-Parameters (Transmission or Chain Parameters) 84

3.6 Summary of Two-Port Parameter Operations 85

3.7 Scattering Parameters 87

3.8 Transmission Parameters 95

References 98

4 Lumped-Element Filters 99

4.1 Introduction 99

4.2 Filter Theory 100

4.3 Butterworth, Chebyshev and Elliptic Low-Pass Prototypes 107

4.4 Filter Design Method 111

4.5 Practical Lumped Elements 120

4.6 Capacitively-Coupled Resonator Filter 121

References 124

5 Transmission Line Theory 125

5.1 Introduction 125

5.2 Reflections on Transmission Lines 126

5.3 Transmission Line Theory 129

5.4 Standing Waves on a Lossless Transmission Line with Mismatched Load 135

5.5 The Smith Chart 142

5.6 The Signal Flow Graph 150

5.7 Conclusion 154

References 154

6 Transmission Line Components 155

6.1 Introduction 155

6.2 Coaxial Components 155

6.3 Twisted Pairs and Twin-Lead 157

6.4 Rectangular Waveguide 158

6.5 Microstrip 161

6.6 Common Microstrip Components 166

6.7 Uniplanar Transmission Lines 177

6.8 Other Transmission Line Types 179

6.9 Conclusion 184

References 185

7 Transmission Line Filters 187

7.1 Introduction 187

7.2 UnloadedQ of a Transmission Line Resonator 188

7.3 Lumped-to-Distributed Conversion 189

7.4 Impedance and Admittance Inverters 191

7.5 Richards Transformation 202

7.6 Unit Element, Kurodas Identity and Coupled-Lines Section 203

7.7 Stepped-Impedance Low-Pass Filter 208

7.8 Parallel-Coupled Line Filter 211

7.9 Interdigital Filter 217

7.10 Combline Filter 223

7.11 Hairpin Filter 233

7.12 Cross-Coupled Filters 237

7.13 Conclusion 246

References 247

8 Semiconductor Devices 248

8.1 Introduction 248

8.2 Fabrication Technology 249

8.3 Field-Effect Transistors 256

8.4 Bipolar Transistors 263

8.5 Package Styles 267

8.6 High-Power Transistors 269

8.7 RFICs and MMICs 271

8.8 Two-Terminal Devices 275

References 277

9 Impedance Matching 279

9.1 Introduction 279

9.2 The Purpose of Impedance Matching 279

9.3 Lumped-Element Matching Networks 282

9.4 Distributed Matching Networks 289

9.5 The Cyclic Nature of Distributed Circuits 295

9.6 Conclusion 296

References 296

10 Amplifiers 298

10.1 Introduction 298

10.2 Transistor Configurations 300

10.3 Classical Analysis of Gain and Stability 302

10.4 DC Biasing 309

10.5 Common Amplifier Topologies 310

10.6 Low-Noise Amplifiers 315

10.7 Nonlinearity and Intermodulation 318

10.8 Power Amplifier Classes of Operation 326

10.9 Power-Combining Techniques 334

10.10 Power Amplifier Linearisation 339

10.11 Conclusion 341

References 342

11 Oscillators 344

11.1 Introduction 344

11.2 Basic Concepts 344

11.3 Resonators 363

11.4 Some Oscillator Circuits 367

11.5 Oscillator Design Procedure 382

11.6 Conclusion 389

References 390

12 Mixers and Modulators 391

12.1 Introduction 391

12.2 Single-Ended Mixers 392

12.3 Balanced and Image-Rejection Mixers 398

12.4 Baluns and Couplers 402

12.5 Common Mixer Circuits 404

12.6 Modulators 409

12.7 Mixer Linearisation and Adaptive Signal Cancellation 412

12.8 Conclusion 412

References 413

13 RF MEMS 415

13.1 Introduction 415

13.2 Novel Transceiver Architectures using RF MEMS 416

13.3 Micromachined Transmission Lines and Passive Elements 416

13.4 RF MEMS Switches 420

13.5 Reconfigurable Impedance-Matching Networks 424

13.6 MEMS Phase Shifters 425

13.7 Tuneable Filters 426

13.8 MEMS Antennas 427

13.9 RF MEMS Fabrication and Packaging 428

13.10 Reliability and Design Consideration of RF MEMS Devices 430

References 432

14 Antennas and Propagation 434

14.1 Introduction 434

14.2 Antenna Systems 437

14.3 Transmission Equations, Free-Space Path Loss and Link Budget Calculation 447

14.4 Other Propagation Effects 451

14.5 Millimetre-Wave and THz Propagation 452

14.6 Indoor Propagation 453

14.7 Outdoor Propagation 455

14.8 Multipath Propagation 457

14.9 Antenna Arrays 458

14.10 Multiple-Input and Multiple-Output Systems 460

References 462

15 Digital Signal Processing for Transceivers 464

15.1 Introduction 464

15.2 RF Performance Challenges 464

15.3 DSP in Modern Wireless Communications Systems 467

15.4 Signal Conversion and Processing 468

15.5 Digital Calibration forIQ Imbalance 482

15.6 Digital Predistortion Techniques 486

15.7 DSP Techniques for OFDM 489

15.8 MIMO 491

15.9 Conclusion 493

References 494

16 Packaging and Assembly 495

16.1 Introduction 495

16.2 Technology Options and System Partitioning 496

16.3 PCB/Laminate Technology 498

16.4 Thin-Film Fabrication 500

16.5 Thick-Film Fabrication 500

16.6 LTCC Technology 503

16.7 Chip Packaging 504

16.8 Manufacturing using Surface Mount Technology 508

16.9 System-in-Package and System-on-Substrate Technology 509

16.10 Transitions and Antenna-in-Package Techniques 512

16.11 Conclusion 512

References 513

17 Electronic Design Automation 515

17.1 Introduction 515

17.2 Linear Frequency-Domain Analysis 518

17.3 Time-Domain Simulation 518

17.4 Harmonic Balance 522

17.5 Large-Signal/Small-Signal Simulation 525

17.6 Planar Electromagnetic Simulation 529

17.7 3-D Electromagnetic Simulation 533

17.8 Integrated Circuit Simulation and Layout 534

17.9 Conclusion 538

References 538

18 Measurement Techniques 539

18.1 Introduction 539

18.2 The Oscilloscope 540

18.3 Function Generator and Arbitrary Waveform Generator 542

18.4 LCR Meters and Component Analysers 542

18.5 Signal Generators 542

18.6 Spectrum and Signal Analysers 544

18.7 Vector Network Analysers 547

18.8 Microstrip Test Fixture Measurements 558

18.9 Probe Station Measurements 560

18.10 Mixed-ModeS-Parameters 563

18.11 Source- and Load-Pull Measurements 565

18.12X-Parameter Measurements 565

References 567

Glossary 569

Index 575

This book describes a full range of contemporary techniques for the design of transmitters and receivers for communications systems operating in the range from 1 through to 300 GHz. In this frequency range there is a wide range of technologies that need to be employed, with silicon ICs at the core but, compared with other electronics systems, a much greater use of more specialist devices and components for high performance for example, high Q-factor/low loss and good power efficiency. Many text books do, of course, cover these topics but what makes this book timely is the rapid adoption of millimetre-waves (frequencies from 30 to 300 GHz) for a wide range of consumer applications such as wireless high definition TV, '5G' Gigabit mobile internet systems and automotive radars. It has taken many years to develop low-cost technologies for suitable transmitters and receivers, so previously these frequencies have been employed only in expensive military and space applications. The book will cover these modern technologies, with the follow topics covered; transmitters and receivers, lumped element filters, tranmission lines and S-parameters, RF MEMS, RFICs and MMICs, and many others.

In addition, the book includes extensive line diagrams to illustrate circuit diagrams and block diagrams of systems, including diagrams and photographs showing how circuits are implemented practically. Furthermore, case studies are also included to explain the salient features of a range of important wireless communications systems. The book is accompanied with suitable design examples and exercises based on the Advanced Design System the industry leading CAD tool for wireless design.

More importantly, the authors have been working with Keysight Technologies on a learning& teaching initiative which is designed to promote access to industry-standard EDA tools such as ADS. Through its University Educational Support Program, Keysight offers students the opportunity to request a student license, backed up with extensive classroom materials and support resources. This culminates with students having the chance to demonstrate their RF/MW design and measurement expertise through the Keysight RF& Microwave Industry-Ready Student Certification Program.

keysight.com/find/eesof-university

keysight.com/find/eesof-student-certification

Professor Ian Robertson, University of Leeds, UK
Ian Robertson (FIEEE 2012) received his BSc (Eng.) and PhD degrees from King's College London in 1984 and 1990, respectively. From 1984 to 1986 he worked in the MMIC Research Group at Plessey Research (Caswell). After that he returned to King's College London, initially as a Research Assistant and then as a Lecturer, leading the MMIC Research Team, and finally becoming Reader in 1994. In 1998 he was appointed Professor of Microwave Subsystems Engineering at the University of Surrey, where he established the Microwave Systems Research Group and was a founder member of the Advanced Technology Institute. In June 2004 he was appointed to the University of Leeds Centenary Chair in Microwave and Millimetre-Wave Circuits and he is now Head of the School of Electronic& Electrical Engineering.

Dr Nutapong Somjit, University of Leeds, UK
Nutapong Somjit?received the Dipl.-Ing. (M.Sc.) from Dresden University of Technology, Dresden, Germany, in 2005, and the PhD from KTH Royal Institute of Technology, Stockholm, Sweden, in 2012, all in electrical engineering. Since August 2012, he has been with the Chair for Circuit Design and Network Theory, Dresden University of Technology, where he leads a research team in microsensors and MEMS ICs. He is currently a lecturer (assistant professor) in the School of Electronic and Electrical Engineering, University of Leeds, United Kingdom.

Dr Mitchai Chongcheawchamnan, Prince of Songkla University, Thailand
Mitchai Chongcheawchamnan was born in Bangkok, Thailand. He received the B.Eng. degree in telecommunication from King Mongkut's Institute of Technology Ladkrabang, Bangkok, in 1992, the M.Sc. degree in communication and signal processing from Imperial College, London, U.K., in 1995, and the Ph.D. degree in electrical engineering from the University of Surrey, Guildford, U.K., in 2001. He joined the Mahanakorn University of Technology, Bangkok, in 1992, as a Lecturer. In 2008, he joined the Faculty of Engineering, Prince of Songkla University, Songkhla, Thailand, as an Associate Professor.